JPS6444641U - - Google Patents
Info
- Publication number
- JPS6444641U JPS6444641U JP13898987U JP13898987U JPS6444641U JP S6444641 U JPS6444641 U JP S6444641U JP 13898987 U JP13898987 U JP 13898987U JP 13898987 U JP13898987 U JP 13898987U JP S6444641 U JPS6444641 U JP S6444641U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat sink
- hybrid integrated
- integrated circuit
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図である
。 １……ヒートシンク、２……基板、３……凹み
、４……貼付面搭載部品、５……表面パターン、
６……貼付面パターン、７……スルーホール、８
……発熱搭載部品。
。 １……ヒートシンク、２……基板、３……凹み
、４……貼付面搭載部品、５……表面パターン、
６……貼付面パターン、７……スルーホール、８
……発熱搭載部品。
Claims (1)
- 両面に回路パターンを有する基板と、この基板
の一面に貼付けたヒートシンクとを有する混成集
積回路において、前記ヒートシンクが、前記基板
の貼付面にある回路パターンの部分のみ凹みを設
けた事を特徴とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898987U JPH0543488Y2 (ja) | 1987-09-10 | 1987-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898987U JPH0543488Y2 (ja) | 1987-09-10 | 1987-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6444641U true JPS6444641U (ja) | 1989-03-16 |
| JPH0543488Y2 JPH0543488Y2 (ja) | 1993-11-02 |
Family
ID=31401831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13898987U Expired - Lifetime JPH0543488Y2 (ja) | 1987-09-10 | 1987-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543488Y2 (ja) |
-
1987
- 1987-09-10 JP JP13898987U patent/JPH0543488Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543488Y2 (ja) | 1993-11-02 |