JPH0338693U - - Google Patents

Info

Publication number
JPH0338693U
JPH0338693U JP9874489U JP9874489U JPH0338693U JP H0338693 U JPH0338693 U JP H0338693U JP 9874489 U JP9874489 U JP 9874489U JP 9874489 U JP9874489 U JP 9874489U JP H0338693 U JPH0338693 U JP H0338693U
Authority
JP
Japan
Prior art keywords
heat conduction
conduction layer
good heat
insulating substrate
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9874489U
Other languages
English (en)
Other versions
JPH073675Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9874489U priority Critical patent/JPH073675Y2/ja
Publication of JPH0338693U publication Critical patent/JPH0338693U/ja
Application granted granted Critical
Publication of JPH073675Y2 publication Critical patent/JPH073675Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Details Of Measuring And Other Instruments (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例の一部を示す断面図
、第２図は他の実施例の一部を示す断面図である
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板に良熱伝導層が形成され、その良熱伝
    導層上に発熱電子部品が実装されると共にその良
    熱伝導層に冷却体が取付けられていることを特徴
    とする実装電子部品の冷却構造。
JP9874489U 1989-08-24 1989-08-24 実装電子部品の冷却構造 Expired - Lifetime JPH073675Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9874489U JPH073675Y2 (ja) 1989-08-24 1989-08-24 実装電子部品の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9874489U JPH073675Y2 (ja) 1989-08-24 1989-08-24 実装電子部品の冷却構造

Publications (2)

Publication Number Publication Date
JPH0338693U true JPH0338693U (ja) 1991-04-15
JPH073675Y2 JPH073675Y2 (ja) 1995-01-30

Family

ID=31647829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9874489U Expired - Lifetime JPH073675Y2 (ja) 1989-08-24 1989-08-24 実装電子部品の冷却構造

Country Status (1)

Country Link
JP (1) JPH073675Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117489A (ja) * 2007-11-02 2009-05-28 Sharp Corp 半導体素子パッケージ及び実装基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117489A (ja) * 2007-11-02 2009-05-28 Sharp Corp 半導体素子パッケージ及び実装基板

Also Published As

Publication number Publication date
JPH073675Y2 (ja) 1995-01-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term