JPH0231190U - - Google Patents
Info
- Publication number
- JPH0231190U JPH0231190U JP11011488U JP11011488U JPH0231190U JP H0231190 U JPH0231190 U JP H0231190U JP 11011488 U JP11011488 U JP 11011488U JP 11011488 U JP11011488 U JP 11011488U JP H0231190 U JPH0231190 U JP H0231190U
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- insulating substrate
- substrate
- integrated circuit
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を説明するための混
成集積回路の断面図、第２図は従来の混成集積回
路を説明するための断面図である。 １…絶縁基板、２…配線導体、３…絶縁性接着
剤、４…放熱板。
成集積回路の断面図、第２図は従来の混成集積回
路を説明するための断面図である。 １…絶縁基板、２…配線導体、３…絶縁性接着
剤、４…放熱板。
Claims (1)
- 絶縁基板の少くとも１つの面に設けた配線導体
と、前記絶縁基板の一方の面の全面に設けた絶縁
性接着剤を介して前記絶縁基板の端部より内側に
接着して設けた前記絶縁基板の面積よりも小さい
面積の放熱板とを有することを特徴とする混成集
積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011488U JPH0231190U (ja) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011488U JPH0231190U (ja) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231190U true JPH0231190U (ja) | 1990-02-27 |
Family
ID=31346979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11011488U Pending JPH0231190U (ja) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231190U (ja) |
-
1988
- 1988-08-22 JP JP11011488U patent/JPH0231190U/ja active Pending