JPH0467369U - - Google Patents
Info
- Publication number
- JPH0467369U JPH0467369U JP11013190U JP11013190U JPH0467369U JP H0467369 U JPH0467369 U JP H0467369U JP 11013190 U JP11013190 U JP 11013190U JP 11013190 U JP11013190 U JP 11013190U JP H0467369 U JPH0467369 U JP H0467369U
- Authority
- JP
- Japan
- Prior art keywords
- conductor wires
- integrated circuit
- hybrid integrated
- insulating substrate
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は、本考案の実施例による混成集積回路
基板の要部断面図、第２図は、同混成集積回路基
板の要部拡大断面図、第３図は、従来例による混
成集積回路基板の要部断面図、第４図は、同混成
集積回路基板の要部拡大断面図である。 １……絶縁基板、３，７……導体配線、６……
絶縁体層、１０……樹脂層。
基板の要部断面図、第２図は、同混成集積回路基
板の要部拡大断面図、第３図は、従来例による混
成集積回路基板の要部断面図、第４図は、同混成
集積回路基板の要部拡大断面図である。 １……絶縁基板、３，７……導体配線、６……
絶縁体層、１０……樹脂層。
Claims (1)
- 絶縁基板１上にガラス材料からなる絶縁体層６
を介して上下に配置された導体配線３，７をもつ
混成集積回路装置において、該導体配線３，７の
重なり合う部分の上に樹脂層１０を形成したこと
を特徴とする混成集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11013190U JPH0467369U (ja) | 1990-10-19 | 1990-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11013190U JPH0467369U (ja) | 1990-10-19 | 1990-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467369U true JPH0467369U (ja) | 1992-06-15 |
Family
ID=31857422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11013190U Pending JPH0467369U (ja) | 1990-10-19 | 1990-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467369U (ja) |
-
1990
- 1990-10-19 JP JP11013190U patent/JPH0467369U/ja active Pending