JPH0442764U - - Google Patents

Info

Publication number
JPH0442764U
JPH0442764U JP8481090U JP8481090U JPH0442764U JP H0442764 U JPH0442764 U JP H0442764U JP 8481090 U JP8481090 U JP 8481090U JP 8481090 U JP8481090 U JP 8481090U JP H0442764 U JPH0442764 U JP H0442764U
Authority
JP
Japan
Prior art keywords
conductor
layer
amorphous
dielectric layer
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8481090U
Other languages
English (en)
Other versions
JPH0731558Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8481090U priority Critical patent/JPH0731558Y2/ja
Publication of JPH0442764U publication Critical patent/JPH0442764U/ja
Application granted granted Critical
Publication of JPH0731558Y2 publication Critical patent/JPH0731558Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案による混成集積回路装置の一実
施例を示す形成工程図、第２図は同混成集積回路
装置の断面図である。 図中、Ａは下部導体、Ｂは１層目の誘電体層、
Ｃは２層目の誘電体層、Ｄは上部導体、Ｅはビア
ホール、Ｔは絶縁基板である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板Ｔ上に下部導体Ａを厚膜にて形成する
    と共に、導体Ａ上に非晶質系で緻密な誘電体層Ｂ
    を下層とし非晶質系でフイラを混ぜた誘電体層Ｃ
    を上層として２層を形成し、その上に上部導体Ｄ
    を形成してなり、前記下部導体Ａと上部導体Ｄと
    をビアホールＥで接続した構成でなる混成集積回
    路装置。
JP8481090U 1990-08-10 1990-08-10 混成集積回路装置 Expired - Lifetime JPH0731558Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8481090U JPH0731558Y2 (ja) 1990-08-10 1990-08-10 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8481090U JPH0731558Y2 (ja) 1990-08-10 1990-08-10 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0442764U true JPH0442764U (ja) 1992-04-10
JPH0731558Y2 JPH0731558Y2 (ja) 1995-07-19

Family

ID=31633537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8481090U Expired - Lifetime JPH0731558Y2 (ja) 1990-08-10 1990-08-10 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0731558Y2 (ja)

Also Published As

Publication number Publication date
JPH0731558Y2 (ja) 1995-07-19

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