JPS61166560U - - Google Patents

Info

Publication number
JPS61166560U
JPS61166560U JP4888985U JP4888985U JPS61166560U JP S61166560 U JPS61166560 U JP S61166560U JP 4888985 U JP4888985 U JP 4888985U JP 4888985 U JP4888985 U JP 4888985U JP S61166560 U JPS61166560 U JP S61166560U
Authority
JP
Japan
Prior art keywords
metal plate
layer
wiring conductor
conductor layer
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4888985U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4888985U priority Critical patent/JPS61166560U/ja
Publication of JPS61166560U publication Critical patent/JPS61166560U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図イ，ロは、本考案の混成集積回路の一実
施例の説明用要部の断面図、第２図は、本考案の
混成集積回路の一実施例の等価回路図、第３図は
従来の混成集積回路の説明用要部の断面図である
。 １：金属板、２：絶縁樹脂層、３：配線導体層
、４：錐穴、５：導電性樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属板上に絶縁樹脂層および配線導体層を順次
    形成した金属ベース基板を用いて構成してなる混
    成集積回路において、上記配線導体層および絶縁
    樹脂層を貫通し、かつ金属板の表面または内部に
    至る有底の錐穴を設け、該錐穴に導電性樹脂を充
    填し配線導体層を金属板に接地したことを特徴と
    する混成集積回路。
JP4888985U 1985-04-01 1985-04-01 Pending JPS61166560U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4888985U JPS61166560U (ja) 1985-04-01 1985-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4888985U JPS61166560U (ja) 1985-04-01 1985-04-01

Publications (1)

Publication Number Publication Date
JPS61166560U true JPS61166560U (ja) 1986-10-16

Family

ID=30565567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4888985U Pending JPS61166560U (ja) 1985-04-01 1985-04-01

Country Status (1)

Country Link
JP (1) JPS61166560U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008187144A (ja) * 2007-01-31 2008-08-14 Sanyo Electric Co Ltd 回路装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717170B2 (ja) * 1976-12-23 1982-04-09
JPS58128785A (ja) * 1982-01-27 1983-08-01 住友電気工業株式会社 金属芯印刷配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717170B2 (ja) * 1976-12-23 1982-04-09
JPS58128785A (ja) * 1982-01-27 1983-08-01 住友電気工業株式会社 金属芯印刷配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008187144A (ja) * 2007-01-31 2008-08-14 Sanyo Electric Co Ltd 回路装置およびその製造方法

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