JPH03110870U - - Google Patents

Info

Publication number
JPH03110870U
JPH03110870U JP1988890U JP1988890U JPH03110870U JP H03110870 U JPH03110870 U JP H03110870U JP 1988890 U JP1988890 U JP 1988890U JP 1988890 U JP1988890 U JP 1988890U JP H03110870 U JPH03110870 U JP H03110870U
Authority
JP
Japan
Prior art keywords
insulator layer
pads
conductor
insulating substrate
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988890U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988890U priority Critical patent/JPH03110870U/ja
Publication of JPH03110870U publication Critical patent/JPH03110870U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例を示す正面図、第２
図は絶縁体層及び導体パドの形成された第１図の
基板１の斜視図、第３図は導体パドの形成された
従来の混成集積回路用基板の斜視図、第４図は従
来の混成集積回路の正面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁性基板と、 その絶縁性基板上に対向して形成された第１、
    第２導体パドと、 上記絶縁性基板上において、上記第１、第２導
    体パドを隔離するように、両者の中間位置に形成
    された絶縁体層と、 その絶縁体層上に配され、上記第１、第２導体
    パド上に渡されて、それらパドにボンデイングさ
    れたチツプ部品とを具備することを特徴とする、 混成集積回路。
JP1988890U 1990-02-28 1990-02-28 Pending JPH03110870U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988890U JPH03110870U (ja) 1990-02-28 1990-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988890U JPH03110870U (ja) 1990-02-28 1990-02-28

Publications (1)

Publication Number Publication Date
JPH03110870U true JPH03110870U (ja) 1991-11-13

Family

ID=31522992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988890U Pending JPH03110870U (ja) 1990-02-28 1990-02-28

Country Status (1)

Country Link
JP (1) JPH03110870U (ja)

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