JPH01179447U - - Google Patents
Info
- Publication number
- JPH01179447U JPH01179447U JP1988075001U JP7500188U JPH01179447U JP H01179447 U JPH01179447 U JP H01179447U JP 1988075001 U JP1988075001 U JP 1988075001U JP 7500188 U JP7500188 U JP 7500188U JP H01179447 U JPH01179447 U JP H01179447U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- mold resin
- lead
- resin
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988075001U JPH01179447U (enExample) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988075001U JPH01179447U (enExample) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179447U true JPH01179447U (enExample) | 1989-12-22 |
Family
ID=31300081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988075001U Pending JPH01179447U (enExample) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179447U (enExample) |
-
1988
- 1988-06-06 JP JP1988075001U patent/JPH01179447U/ja active Pending