JPS63128745U - - Google Patents
Info
- Publication number
- JPS63128745U JPS63128745U JP1987020876U JP2087687U JPS63128745U JP S63128745 U JPS63128745 U JP S63128745U JP 1987020876 U JP1987020876 U JP 1987020876U JP 2087687 U JP2087687 U JP 2087687U JP S63128745 U JPS63128745 U JP S63128745U
- Authority
- JP
- Japan
- Prior art keywords
- resin molded
- package
- semiconductor device
- external connection
- pulled out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020876U JPS63128745U (enExample) | 1987-02-16 | 1987-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020876U JPS63128745U (enExample) | 1987-02-16 | 1987-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128745U true JPS63128745U (enExample) | 1988-08-23 |
Family
ID=30816793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987020876U Pending JPS63128745U (enExample) | 1987-02-16 | 1987-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128745U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020039466A1 (ja) * | 2018-08-20 | 2020-02-27 | 三菱電機株式会社 | 半導体モジュール |
-
1987
- 1987-02-16 JP JP1987020876U patent/JPS63128745U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020039466A1 (ja) * | 2018-08-20 | 2020-02-27 | 三菱電機株式会社 | 半導体モジュール |
| JPWO2020039466A1 (ja) * | 2018-08-20 | 2021-06-03 | 三菱電機株式会社 | 半導体モジュール |
| US11621216B2 (en) | 2018-08-20 | 2023-04-04 | Mitsubishi Electric Corporation | Semiconductor module |