JPS61162056U - - Google Patents
Info
- Publication number
- JPS61162056U JPS61162056U JP1985044248U JP4424885U JPS61162056U JP S61162056 U JPS61162056 U JP S61162056U JP 1985044248 U JP1985044248 U JP 1985044248U JP 4424885 U JP4424885 U JP 4424885U JP S61162056 U JPS61162056 U JP S61162056U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- package
- chip
- cavity
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/753—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985044248U JPS61162056U (enExample) | 1985-03-27 | 1985-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985044248U JPS61162056U (enExample) | 1985-03-27 | 1985-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61162056U true JPS61162056U (enExample) | 1986-10-07 |
Family
ID=30556653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985044248U Pending JPS61162056U (enExample) | 1985-03-27 | 1985-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61162056U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0269967A (ja) * | 1988-09-05 | 1990-03-08 | Nippon Telegr & Teleph Corp <Ntt> | 高速・高周波集積回路用パッケージ |
-
1985
- 1985-03-27 JP JP1985044248U patent/JPS61162056U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0269967A (ja) * | 1988-09-05 | 1990-03-08 | Nippon Telegr & Teleph Corp <Ntt> | 高速・高周波集積回路用パッケージ |