JPH01140843U - - Google Patents
Info
- Publication number
- JPH01140843U JPH01140843U JP1988036480U JP3648088U JPH01140843U JP H01140843 U JPH01140843 U JP H01140843U JP 1988036480 U JP1988036480 U JP 1988036480U JP 3648088 U JP3648088 U JP 3648088U JP H01140843 U JPH01140843 U JP H01140843U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- resin
- lead
- semiconductor element
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036480U JPH01140843U (enExample) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036480U JPH01140843U (enExample) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140843U true JPH01140843U (enExample) | 1989-09-27 |
Family
ID=31263082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036480U Pending JPH01140843U (enExample) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140843U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017039298A (ja) * | 2015-08-21 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | 樹脂成形体 |
-
1988
- 1988-03-18 JP JP1988036480U patent/JPH01140843U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017039298A (ja) * | 2015-08-21 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | 樹脂成形体 |