JPH0467346U - - Google Patents
Info
- Publication number
- JPH0467346U JPH0467346U JP1990110993U JP11099390U JPH0467346U JP H0467346 U JPH0467346 U JP H0467346U JP 1990110993 U JP1990110993 U JP 1990110993U JP 11099390 U JP11099390 U JP 11099390U JP H0467346 U JPH0467346 U JP H0467346U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- semiconductor integrated
- resin
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110993U JPH0467346U (enExample) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110993U JPH0467346U (enExample) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467346U true JPH0467346U (enExample) | 1992-06-15 |
Family
ID=31858404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990110993U Pending JPH0467346U (enExample) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467346U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |
-
1990
- 1990-10-23 JP JP1990110993U patent/JPH0467346U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |