JPH02101535U - - Google Patents
Info
- Publication number
- JPH02101535U JPH02101535U JP1989008702U JP870289U JPH02101535U JP H02101535 U JPH02101535 U JP H02101535U JP 1989008702 U JP1989008702 U JP 1989008702U JP 870289 U JP870289 U JP 870289U JP H02101535 U JPH02101535 U JP H02101535U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- package
- circuit package
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W70/682—
-
- H10W72/884—
-
- H10W72/931—
-
- H10W90/734—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008702U JPH02101535U (enExample) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008702U JPH02101535U (enExample) | 1989-01-27 | 1989-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101535U true JPH02101535U (enExample) | 1990-08-13 |
Family
ID=31214811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989008702U Pending JPH02101535U (enExample) | 1989-01-27 | 1989-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101535U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |
-
1989
- 1989-01-27 JP JP1989008702U patent/JPH02101535U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |