JPH031431U - - Google Patents
Info
- Publication number
- JPH031431U JPH031431U JP1989058814U JP5881489U JPH031431U JP H031431 U JPH031431 U JP H031431U JP 1989058814 U JP1989058814 U JP 1989058814U JP 5881489 U JP5881489 U JP 5881489U JP H031431 U JPH031431 U JP H031431U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- utility
- semiconductor chip
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058814U JPH031431U (enExample) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058814U JPH031431U (enExample) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031431U true JPH031431U (enExample) | 1991-01-09 |
Family
ID=31584766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989058814U Pending JPH031431U (enExample) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031431U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (ja) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | 足指を甲被から個別に突き出すことを可能とした履物 |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
-
1989
- 1989-05-22 JP JP1989058814U patent/JPH031431U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (ja) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | 足指を甲被から個別に突き出すことを可能とした履物 |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |