JPH02102729U - - Google Patents
Info
- Publication number
- JPH02102729U JPH02102729U JP1989011323U JP1132389U JPH02102729U JP H02102729 U JPH02102729 U JP H02102729U JP 1989011323 U JP1989011323 U JP 1989011323U JP 1132389 U JP1132389 U JP 1132389U JP H02102729 U JPH02102729 U JP H02102729U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- utility
- semiconductor chip
- die part
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/884—
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- H10W72/931—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011323U JPH02102729U (enExample) | 1989-02-01 | 1989-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011323U JPH02102729U (enExample) | 1989-02-01 | 1989-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102729U true JPH02102729U (enExample) | 1990-08-15 |
Family
ID=31219778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011323U Pending JPH02102729U (enExample) | 1989-02-01 | 1989-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102729U (enExample) |
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1989
- 1989-02-01 JP JP1989011323U patent/JPH02102729U/ja active Pending