JPH0328742U - - Google Patents
Info
- Publication number
- JPH0328742U JPH0328742U JP1989089708U JP8970889U JPH0328742U JP H0328742 U JPH0328742 U JP H0328742U JP 1989089708 U JP1989089708 U JP 1989089708U JP 8970889 U JP8970889 U JP 8970889U JP H0328742 U JPH0328742 U JP H0328742U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- resin
- resin frame
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089708U JPH0328742U (enExample) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089708U JPH0328742U (enExample) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328742U true JPH0328742U (enExample) | 1991-03-22 |
Family
ID=31639277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089708U Pending JPH0328742U (enExample) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328742U (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0580230U (ja) * | 1992-04-07 | 1993-11-02 | セイレイ工業株式会社 | 脱穀装置 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| JPWO2014006699A1 (ja) * | 2012-07-04 | 2016-06-02 | 富士機械製造株式会社 | 半導体パッケージ及びその製造方法 |
-
1989
- 1989-07-28 JP JP1989089708U patent/JPH0328742U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0580230U (ja) * | 1992-04-07 | 1993-11-02 | セイレイ工業株式会社 | 脱穀装置 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| CN102484102A (zh) * | 2009-08-24 | 2012-05-30 | 本田技研工业株式会社 | 电子器件以及电子器件的制造方法 |
| US8497166B2 (en) | 2009-08-24 | 2013-07-30 | Honda Motor Co., Ltd. | Electronic device and method of manufacturing electronic device |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| JPWO2014006699A1 (ja) * | 2012-07-04 | 2016-06-02 | 富士機械製造株式会社 | 半導体パッケージ及びその製造方法 |