JPS6413146U - - Google Patents
Info
- Publication number
- JPS6413146U JPS6413146U JP10543187U JP10543187U JPS6413146U JP S6413146 U JPS6413146 U JP S6413146U JP 10543187 U JP10543187 U JP 10543187U JP 10543187 U JP10543187 U JP 10543187U JP S6413146 U JPS6413146 U JP S6413146U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- notch
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/737—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10543187U JPS6413146U (enExample) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10543187U JPS6413146U (enExample) | 1987-07-09 | 1987-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413146U true JPS6413146U (enExample) | 1989-01-24 |
Family
ID=31338038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10543187U Pending JPS6413146U (enExample) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413146U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156610A (ja) * | 2004-11-29 | 2006-06-15 | Nidec Copal Electronics Corp | 回路基板 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
-
1987
- 1987-07-09 JP JP10543187U patent/JPS6413146U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156610A (ja) * | 2004-11-29 | 2006-06-15 | Nidec Copal Electronics Corp | 回路基板 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |