JPH0236037U - - Google Patents
Info
- Publication number
- JPH0236037U JPH0236037U JP1988115358U JP11535888U JPH0236037U JP H0236037 U JPH0236037 U JP H0236037U JP 1988115358 U JP1988115358 U JP 1988115358U JP 11535888 U JP11535888 U JP 11535888U JP H0236037 U JPH0236037 U JP H0236037U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- wiring board
- printed wiring
- insulating substrate
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/536—
-
- H10W72/5363—
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115358U JPH0236037U (enExample) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115358U JPH0236037U (enExample) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236037U true JPH0236037U (enExample) | 1990-03-08 |
Family
ID=31356946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988115358U Pending JPH0236037U (enExample) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236037U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131039A (ja) * | 2006-11-21 | 2008-06-05 | Samsung Electro-Mechanics Co Ltd | 電子素子内蔵型印刷回路基板の製造方法 |
-
1988
- 1988-08-31 JP JP1988115358U patent/JPH0236037U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131039A (ja) * | 2006-11-21 | 2008-06-05 | Samsung Electro-Mechanics Co Ltd | 電子素子内蔵型印刷回路基板の製造方法 |