JPH0189789U - - Google Patents
Info
- Publication number
- JPH0189789U JPH0189789U JP1987185525U JP18552587U JPH0189789U JP H0189789 U JPH0189789 U JP H0189789U JP 1987185525 U JP1987185525 U JP 1987185525U JP 18552587 U JP18552587 U JP 18552587U JP H0189789 U JPH0189789 U JP H0189789U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- hybrid integrated
- circuit device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185525U JPH0189789U (enExample) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185525U JPH0189789U (enExample) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189789U true JPH0189789U (enExample) | 1989-06-13 |
Family
ID=31476839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987185525U Pending JPH0189789U (enExample) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189789U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |
-
1987
- 1987-12-04 JP JP1987185525U patent/JPH0189789U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |