JPH03101529U - - Google Patents

Info

Publication number
JPH03101529U
JPH03101529U JP1990009482U JP948290U JPH03101529U JP H03101529 U JPH03101529 U JP H03101529U JP 1990009482 U JP1990009482 U JP 1990009482U JP 948290 U JP948290 U JP 948290U JP H03101529 U JPH03101529 U JP H03101529U
Authority
JP
Japan
Prior art keywords
tab tape
wiring board
wiring
conductive
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990009482U
Other languages
English (en)
Japanese (ja)
Other versions
JP2525353Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009482U priority Critical patent/JP2525353Y2/ja
Publication of JPH03101529U publication Critical patent/JPH03101529U/ja
Application granted granted Critical
Publication of JP2525353Y2 publication Critical patent/JP2525353Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/877—

Landscapes

  • Wire Bonding (AREA)
JP1990009482U 1990-01-31 1990-01-31 半導体装置用回路基板 Expired - Fee Related JP2525353Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009482U JP2525353Y2 (ja) 1990-01-31 1990-01-31 半導体装置用回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009482U JP2525353Y2 (ja) 1990-01-31 1990-01-31 半導体装置用回路基板

Publications (2)

Publication Number Publication Date
JPH03101529U true JPH03101529U (enExample) 1991-10-23
JP2525353Y2 JP2525353Y2 (ja) 1997-02-12

Family

ID=31513082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009482U Expired - Fee Related JP2525353Y2 (ja) 1990-01-31 1990-01-31 半導体装置用回路基板

Country Status (1)

Country Link
JP (1) JP2525353Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129745A (ja) * 1989-10-16 1991-06-03 Sumitomo Bakelite Co Ltd 半導体装置の実装方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129745A (ja) * 1989-10-16 1991-06-03 Sumitomo Bakelite Co Ltd 半導体装置の実装方法

Also Published As

Publication number Publication date
JP2525353Y2 (ja) 1997-02-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees