JPH0238743U - - Google Patents
Info
- Publication number
- JPH0238743U JPH0238743U JP1988116902U JP11690288U JPH0238743U JP H0238743 U JPH0238743 U JP H0238743U JP 1988116902 U JP1988116902 U JP 1988116902U JP 11690288 U JP11690288 U JP 11690288U JP H0238743 U JPH0238743 U JP H0238743U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor element
- conductive metal
- printed wiring
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W70/681—
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- H10W70/682—
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- H10W70/685—
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- H10W72/884—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116902U JPH0238743U (enExample) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116902U JPH0238743U (enExample) | 1988-09-07 | 1988-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238743U true JPH0238743U (enExample) | 1990-03-15 |
Family
ID=31359865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116902U Pending JPH0238743U (enExample) | 1988-09-07 | 1988-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238743U (enExample) |
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1988
- 1988-09-07 JP JP1988116902U patent/JPH0238743U/ja active Pending