JPH0247062U - - Google Patents
Info
- Publication number
- JPH0247062U JPH0247062U JP1988125866U JP12586688U JPH0247062U JP H0247062 U JPH0247062 U JP H0247062U JP 1988125866 U JP1988125866 U JP 1988125866U JP 12586688 U JP12586688 U JP 12586688U JP H0247062 U JPH0247062 U JP H0247062U
- Authority
- JP
- Japan
- Prior art keywords
- back side
- lead frame
- chip
- insulating coating
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W72/073—
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- H10W72/884—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125866U JPH0247062U (enExample) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125866U JPH0247062U (enExample) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247062U true JPH0247062U (enExample) | 1990-03-30 |
Family
ID=31376851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125866U Pending JPH0247062U (enExample) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247062U (enExample) |
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1988
- 1988-09-26 JP JP1988125866U patent/JPH0247062U/ja active Pending