JPH02146437U - - Google Patents
Info
- Publication number
- JPH02146437U JPH02146437U JP1989056630U JP5663089U JPH02146437U JP H02146437 U JPH02146437 U JP H02146437U JP 1989056630 U JP1989056630 U JP 1989056630U JP 5663089 U JP5663089 U JP 5663089U JP H02146437 U JPH02146437 U JP H02146437U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- lead frame
- terminal
- pellet
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056630U JPH02146437U (enExample) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056630U JPH02146437U (enExample) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146437U true JPH02146437U (enExample) | 1990-12-12 |
Family
ID=31580626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989056630U Pending JPH02146437U (enExample) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146437U (enExample) |
-
1989
- 1989-05-16 JP JP1989056630U patent/JPH02146437U/ja active Pending