JPH0470738U - - Google Patents
Info
- Publication number
- JPH0470738U JPH0470738U JP1990114408U JP11440890U JPH0470738U JP H0470738 U JPH0470738 U JP H0470738U JP 1990114408 U JP1990114408 U JP 1990114408U JP 11440890 U JP11440890 U JP 11440890U JP H0470738 U JPH0470738 U JP H0470738U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die bonding
- chamfered
- bonded
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114408U JPH0470738U (enExample) | 1990-10-31 | 1990-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114408U JPH0470738U (enExample) | 1990-10-31 | 1990-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470738U true JPH0470738U (enExample) | 1992-06-23 |
Family
ID=31862083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990114408U Pending JPH0470738U (enExample) | 1990-10-31 | 1990-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470738U (enExample) |
-
1990
- 1990-10-31 JP JP1990114408U patent/JPH0470738U/ja active Pending