JPH01127258U - - Google Patents
Info
- Publication number
- JPH01127258U JPH01127258U JP1988022885U JP2288588U JPH01127258U JP H01127258 U JPH01127258 U JP H01127258U JP 1988022885 U JP1988022885 U JP 1988022885U JP 2288588 U JP2288588 U JP 2288588U JP H01127258 U JPH01127258 U JP H01127258U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- bonding line
- sealed semiconductor
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022885U JPH01127258U (enExample) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022885U JPH01127258U (enExample) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127258U true JPH01127258U (enExample) | 1989-08-31 |
Family
ID=31241400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988022885U Pending JPH01127258U (enExample) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127258U (enExample) |
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1988
- 1988-02-23 JP JP1988022885U patent/JPH01127258U/ja active Pending