JPH0279057U - - Google Patents

Info

Publication number
JPH0279057U
JPH0279057U JP1988157955U JP15795588U JPH0279057U JP H0279057 U JPH0279057 U JP H0279057U JP 1988157955 U JP1988157955 U JP 1988157955U JP 15795588 U JP15795588 U JP 15795588U JP H0279057 U JPH0279057 U JP H0279057U
Authority
JP
Japan
Prior art keywords
resin
lead frame
sealed
semiconductor device
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988157955U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988157955U priority Critical patent/JPH0279057U/ja
Publication of JPH0279057U publication Critical patent/JPH0279057U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/536
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988157955U 1988-12-02 1988-12-02 Pending JPH0279057U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988157955U JPH0279057U (enExample) 1988-12-02 1988-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988157955U JPH0279057U (enExample) 1988-12-02 1988-12-02

Publications (1)

Publication Number Publication Date
JPH0279057U true JPH0279057U (enExample) 1990-06-18

Family

ID=31437850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988157955U Pending JPH0279057U (enExample) 1988-12-02 1988-12-02

Country Status (1)

Country Link
JP (1) JPH0279057U (enExample)

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