JPH0256439U - - Google Patents
Info
- Publication number
- JPH0256439U JPH0256439U JP1988135214U JP13521488U JPH0256439U JP H0256439 U JPH0256439 U JP H0256439U JP 1988135214 U JP1988135214 U JP 1988135214U JP 13521488 U JP13521488 U JP 13521488U JP H0256439 U JPH0256439 U JP H0256439U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonded
- convex portion
- external lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/07352—
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- H10W72/321—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135214U JPH0256439U (enExample) | 1988-10-17 | 1988-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135214U JPH0256439U (enExample) | 1988-10-17 | 1988-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256439U true JPH0256439U (enExample) | 1990-04-24 |
Family
ID=31394644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988135214U Pending JPH0256439U (enExample) | 1988-10-17 | 1988-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256439U (enExample) |
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1988
- 1988-10-17 JP JP1988135214U patent/JPH0256439U/ja active Pending