JPH01121928U - - Google Patents
Info
- Publication number
- JPH01121928U JPH01121928U JP1988017145U JP1714588U JPH01121928U JP H01121928 U JPH01121928 U JP H01121928U JP 1988017145 U JP1988017145 U JP 1988017145U JP 1714588 U JP1714588 U JP 1714588U JP H01121928 U JPH01121928 U JP H01121928U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- integrated circuit
- circuit device
- semiconductor integrated
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07511—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5434—
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- H10W72/59—
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- H10W72/983—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017145U JPH01121928U (enExample) | 1988-02-12 | 1988-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017145U JPH01121928U (enExample) | 1988-02-12 | 1988-02-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121928U true JPH01121928U (enExample) | 1989-08-18 |
Family
ID=31230667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017145U Pending JPH01121928U (enExample) | 1988-02-12 | 1988-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121928U (enExample) |
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1988
- 1988-02-12 JP JP1988017145U patent/JPH01121928U/ja active Pending