JPH0388350U - - Google Patents
Info
- Publication number
- JPH0388350U JPH0388350U JP1989150344U JP15034489U JPH0388350U JP H0388350 U JPH0388350 U JP H0388350U JP 1989150344 U JP1989150344 U JP 1989150344U JP 15034489 U JP15034489 U JP 15034489U JP H0388350 U JPH0388350 U JP H0388350U
- Authority
- JP
- Japan
- Prior art keywords
- tab tape
- semiconductor chip
- semiconductor device
- bonded
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W76/12—
-
- H10W72/701—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150344U JPH0388350U (enExample) | 1989-12-26 | 1989-12-26 | |
| KR2019900019502U KR930003872Y1 (ko) | 1989-12-26 | 1990-12-11 | 반도체 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150344U JPH0388350U (enExample) | 1989-12-26 | 1989-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388350U true JPH0388350U (enExample) | 1991-09-10 |
Family
ID=15494942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989150344U Pending JPH0388350U (enExample) | 1989-12-26 | 1989-12-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0388350U (enExample) |
| KR (1) | KR930003872Y1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301782B1 (ko) * | 2011-03-30 | 2013-08-29 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
| JPH01304738A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体装置のパッケージ構造 |
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1989
- 1989-12-26 JP JP1989150344U patent/JPH0388350U/ja active Pending
-
1990
- 1990-12-11 KR KR2019900019502U patent/KR930003872Y1/ko not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
| JPH01304738A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体装置のパッケージ構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR910013038U (ko) | 1991-07-30 |
| KR930003872Y1 (ko) | 1993-06-23 |