JPS6361149U - - Google Patents
Info
- Publication number
- JPS6361149U JPS6361149U JP1986155892U JP15589286U JPS6361149U JP S6361149 U JPS6361149 U JP S6361149U JP 1986155892 U JP1986155892 U JP 1986155892U JP 15589286 U JP15589286 U JP 15589286U JP S6361149 U JPS6361149 U JP S6361149U
- Authority
- JP
- Japan
- Prior art keywords
- metal piece
- piece
- external leads
- semiconductor device
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155892U JPS6361149U (enExample) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155892U JPS6361149U (enExample) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361149U true JPS6361149U (enExample) | 1988-04-22 |
Family
ID=31077005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986155892U Pending JPS6361149U (enExample) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361149U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (ja) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置とその製造方法、リードフレーム |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
-
1986
- 1986-10-09 JP JP1986155892U patent/JPS6361149U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (ja) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置とその製造方法、リードフレーム |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |