JPS6190245U - - Google Patents
Info
- Publication number
- JPS6190245U JPS6190245U JP1984175211U JP17521184U JPS6190245U JP S6190245 U JPS6190245 U JP S6190245U JP 1984175211 U JP1984175211 U JP 1984175211U JP 17521184 U JP17521184 U JP 17521184U JP S6190245 U JPS6190245 U JP S6190245U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- utility
- scope
- external connection
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984175211U JPS6190245U (enExample) | 1984-11-19 | 1984-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984175211U JPS6190245U (enExample) | 1984-11-19 | 1984-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190245U true JPS6190245U (enExample) | 1986-06-12 |
Family
ID=30732815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984175211U Pending JPS6190245U (enExample) | 1984-11-19 | 1984-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190245U (enExample) |
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1984
- 1984-11-19 JP JP1984175211U patent/JPS6190245U/ja active Pending