JPH0195759U - - Google Patents
Info
- Publication number
- JPH0195759U JPH0195759U JP1987192375U JP19237587U JPH0195759U JP H0195759 U JPH0195759 U JP H0195759U JP 1987192375 U JP1987192375 U JP 1987192375U JP 19237587 U JP19237587 U JP 19237587U JP H0195759 U JPH0195759 U JP H0195759U
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- metal
- lead
- semiconductor chip
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987192375U JPH0195759U (enExample) | 1987-12-17 | 1987-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987192375U JPH0195759U (enExample) | 1987-12-17 | 1987-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195759U true JPH0195759U (enExample) | 1989-06-26 |
Family
ID=31483237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987192375U Pending JPH0195759U (enExample) | 1987-12-17 | 1987-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195759U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03169693A (ja) * | 1989-11-30 | 1991-07-23 | Toshiba Corp | カード状電子機器およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612360B2 (enExample) * | 1976-06-21 | 1981-03-20 | ||
| JPS58143541A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置 |
-
1987
- 1987-12-17 JP JP1987192375U patent/JPH0195759U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612360B2 (enExample) * | 1976-06-21 | 1981-03-20 | ||
| JPS58143541A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03169693A (ja) * | 1989-11-30 | 1991-07-23 | Toshiba Corp | カード状電子機器およびその製造方法 |