JPH01100457U - - Google Patents
Info
- Publication number
- JPH01100457U JPH01100457U JP1987195253U JP19525387U JPH01100457U JP H01100457 U JPH01100457 U JP H01100457U JP 1987195253 U JP1987195253 U JP 1987195253U JP 19525387 U JP19525387 U JP 19525387U JP H01100457 U JPH01100457 U JP H01100457U
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- lead pattern
- metal
- insulating film
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195253U JP2516390Y2 (ja) | 1987-12-23 | 1987-12-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195253U JP2516390Y2 (ja) | 1987-12-23 | 1987-12-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01100457U true JPH01100457U (enExample) | 1989-07-05 |
| JP2516390Y2 JP2516390Y2 (ja) | 1996-11-06 |
Family
ID=31485939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987195253U Expired - Lifetime JP2516390Y2 (ja) | 1987-12-23 | 1987-12-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2516390Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010097511A (ko) * | 2000-04-24 | 2001-11-08 | 이중구 | 이층형 칩 스케일 반도체 팩키지 및, 그것의 제조 방법 |
-
1987
- 1987-12-23 JP JP1987195253U patent/JP2516390Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2516390Y2 (ja) | 1996-11-06 |