JPS61207027U - - Google Patents
Info
- Publication number
- JPS61207027U JPS61207027U JP1985091727U JP9172785U JPS61207027U JP S61207027 U JPS61207027 U JP S61207027U JP 1985091727 U JP1985091727 U JP 1985091727U JP 9172785 U JP9172785 U JP 9172785U JP S61207027 U JPS61207027 U JP S61207027U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- lead frame
- sheet
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985091727U JPS61207027U (enExample) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985091727U JPS61207027U (enExample) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207027U true JPS61207027U (enExample) | 1986-12-27 |
Family
ID=30647871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985091727U Pending JPS61207027U (enExample) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207027U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834934A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |
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1985
- 1985-06-18 JP JP1985091727U patent/JPS61207027U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834934A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |