JPS6390862U - - Google Patents
Info
- Publication number
- JPS6390862U JPS6390862U JP1986185825U JP18582586U JPS6390862U JP S6390862 U JPS6390862 U JP S6390862U JP 1986185825 U JP1986185825 U JP 1986185825U JP 18582586 U JP18582586 U JP 18582586U JP S6390862 U JPS6390862 U JP S6390862U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- insulating tape
- resistant insulating
- planted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185825U JPS6390862U (enExample) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185825U JPS6390862U (enExample) | 1986-12-01 | 1986-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390862U true JPS6390862U (enExample) | 1988-06-13 |
Family
ID=31134815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986185825U Pending JPS6390862U (enExample) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390862U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55121672A (en) * | 1979-03-13 | 1980-09-18 | Mitsubishi Electric Corp | Semiconductor device |
| JPS57184239A (en) * | 1981-05-08 | 1982-11-12 | Nec Corp | Substrate for semiconductor device |
| JPS59228739A (ja) * | 1983-06-10 | 1984-12-22 | Hitachi Ltd | 半導体装置 |
-
1986
- 1986-12-01 JP JP1986185825U patent/JPS6390862U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55121672A (en) * | 1979-03-13 | 1980-09-18 | Mitsubishi Electric Corp | Semiconductor device |
| JPS57184239A (en) * | 1981-05-08 | 1982-11-12 | Nec Corp | Substrate for semiconductor device |
| JPS59228739A (ja) * | 1983-06-10 | 1984-12-22 | Hitachi Ltd | 半導体装置 |