JPH0295241U - - Google Patents

Info

Publication number
JPH0295241U
JPH0295241U JP1989004703U JP470389U JPH0295241U JP H0295241 U JPH0295241 U JP H0295241U JP 1989004703 U JP1989004703 U JP 1989004703U JP 470389 U JP470389 U JP 470389U JP H0295241 U JPH0295241 U JP H0295241U
Authority
JP
Japan
Prior art keywords
bonding area
semiconductor device
bonding
support
internal lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989004703U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989004703U priority Critical patent/JPH0295241U/ja
Publication of JPH0295241U publication Critical patent/JPH0295241U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1989004703U 1989-01-18 1989-01-18 Pending JPH0295241U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989004703U JPH0295241U (enExample) 1989-01-18 1989-01-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989004703U JPH0295241U (enExample) 1989-01-18 1989-01-18

Publications (1)

Publication Number Publication Date
JPH0295241U true JPH0295241U (enExample) 1990-07-30

Family

ID=31207451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989004703U Pending JPH0295241U (enExample) 1989-01-18 1989-01-18

Country Status (1)

Country Link
JP (1) JPH0295241U (enExample)

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