JPS6359325U - - Google Patents
Info
- Publication number
- JPS6359325U JPS6359325U JP1986153452U JP15345286U JPS6359325U JP S6359325 U JPS6359325 U JP S6359325U JP 1986153452 U JP1986153452 U JP 1986153452U JP 15345286 U JP15345286 U JP 15345286U JP S6359325 U JPS6359325 U JP S6359325U
- Authority
- JP
- Japan
- Prior art keywords
- die
- lead frame
- bonding
- lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153452U JPS6359325U (enExample) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153452U JPS6359325U (enExample) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359325U true JPS6359325U (enExample) | 1988-04-20 |
Family
ID=31072347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986153452U Pending JPS6359325U (enExample) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359325U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016187059A (ja) * | 2016-08-03 | 2016-10-27 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
-
1986
- 1986-10-06 JP JP1986153452U patent/JPS6359325U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10243515B2 (en) | 2012-04-27 | 2019-03-26 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10622944B2 (en) | 2012-04-27 | 2020-04-14 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| JP2016187059A (ja) * | 2016-08-03 | 2016-10-27 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |