JPH02146439U - - Google Patents
Info
- Publication number
- JPH02146439U JPH02146439U JP1989055490U JP5549089U JPH02146439U JP H02146439 U JPH02146439 U JP H02146439U JP 1989055490 U JP1989055490 U JP 1989055490U JP 5549089 U JP5549089 U JP 5549089U JP H02146439 U JPH02146439 U JP H02146439U
- Authority
- JP
- Japan
- Prior art keywords
- pad electrode
- wire bonding
- semiconductor device
- electrode structure
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07141—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/536—
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- H10W72/59—
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- H10W72/934—
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- H10W72/983—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055490U JPH02146439U (enExample) | 1989-05-15 | 1989-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055490U JPH02146439U (enExample) | 1989-05-15 | 1989-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146439U true JPH02146439U (enExample) | 1990-12-12 |
Family
ID=31578488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055490U Pending JPH02146439U (enExample) | 1989-05-15 | 1989-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146439U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071317A (ja) * | 2009-09-25 | 2011-04-07 | Renesas Electronics Corp | 半導体装置 |
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1989
- 1989-05-15 JP JP1989055490U patent/JPH02146439U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071317A (ja) * | 2009-09-25 | 2011-04-07 | Renesas Electronics Corp | 半導体装置 |
| US8772952B2 (en) | 2009-09-25 | 2014-07-08 | Renesas Electronics Corporation | Semiconductor device with copper wire having different width portions |
| US9024454B2 (en) | 2009-09-25 | 2015-05-05 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |