JPS63127127U - - Google Patents
Info
- Publication number
- JPS63127127U JPS63127127U JP1987018103U JP1810387U JPS63127127U JP S63127127 U JPS63127127 U JP S63127127U JP 1987018103 U JP1987018103 U JP 1987018103U JP 1810387 U JP1810387 U JP 1810387U JP S63127127 U JPS63127127 U JP S63127127U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hole
- island
- thin film
- metal thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/30—
-
- H10W72/07353—
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- H10W72/334—
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- H10W72/884—
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- H10W72/931—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987018103U JPH0625004Y2 (ja) | 1987-02-09 | 1987-02-09 | 集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987018103U JPH0625004Y2 (ja) | 1987-02-09 | 1987-02-09 | 集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127127U true JPS63127127U (enExample) | 1988-08-19 |
| JPH0625004Y2 JPH0625004Y2 (ja) | 1994-06-29 |
Family
ID=30811476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987018103U Expired - Lifetime JPH0625004Y2 (ja) | 1987-02-09 | 1987-02-09 | 集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625004Y2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162353A (en) * | 1981-03-31 | 1982-10-06 | Nec Corp | Package for semiconductor device |
| JPS59155159A (ja) * | 1983-02-24 | 1984-09-04 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
-
1987
- 1987-02-09 JP JP1987018103U patent/JPH0625004Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162353A (en) * | 1981-03-31 | 1982-10-06 | Nec Corp | Package for semiconductor device |
| JPS59155159A (ja) * | 1983-02-24 | 1984-09-04 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625004Y2 (ja) | 1994-06-29 |