JPS63127129U - - Google Patents
Info
- Publication number
- JPS63127129U JPS63127129U JP1987018937U JP1893787U JPS63127129U JP S63127129 U JPS63127129 U JP S63127129U JP 1987018937 U JP1987018937 U JP 1987018937U JP 1893787 U JP1893787 U JP 1893787U JP S63127129 U JPS63127129 U JP S63127129U
- Authority
- JP
- Japan
- Prior art keywords
- silicon chip
- sealed
- resin
- integrated circuit
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/381—
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987018937U JPS63127129U (enExample) | 1987-02-10 | 1987-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987018937U JPS63127129U (enExample) | 1987-02-10 | 1987-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63127129U true JPS63127129U (enExample) | 1988-08-19 |
Family
ID=30813073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987018937U Pending JPS63127129U (enExample) | 1987-02-10 | 1987-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63127129U (enExample) |
-
1987
- 1987-02-10 JP JP1987018937U patent/JPS63127129U/ja active Pending