JPS6230341U - - Google Patents
Info
- Publication number
- JPS6230341U JPS6230341U JP1985121999U JP12199985U JPS6230341U JP S6230341 U JPS6230341 U JP S6230341U JP 1985121999 U JP1985121999 U JP 1985121999U JP 12199985 U JP12199985 U JP 12199985U JP S6230341 U JPS6230341 U JP S6230341U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- integrated circuit
- pad portion
- semiconductor integrated
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W70/60—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/59—
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- H10W72/923—
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- H10W72/934—
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- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985121999U JPS6230341U (enExample) | 1985-08-08 | 1985-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985121999U JPS6230341U (enExample) | 1985-08-08 | 1985-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230341U true JPS6230341U (enExample) | 1987-02-24 |
Family
ID=31011787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985121999U Pending JPS6230341U (enExample) | 1985-08-08 | 1985-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230341U (enExample) |
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1985
- 1985-08-08 JP JP1985121999U patent/JPS6230341U/ja active Pending