JPS61195053U - - Google Patents
Info
- Publication number
- JPS61195053U JPS61195053U JP7767085U JP7767085U JPS61195053U JP S61195053 U JPS61195053 U JP S61195053U JP 7767085 U JP7767085 U JP 7767085U JP 7767085 U JP7767085 U JP 7767085U JP S61195053 U JPS61195053 U JP S61195053U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal core
- core printed
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7767085U JPS61195053U (enExample) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7767085U JPS61195053U (enExample) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195053U true JPS61195053U (enExample) | 1986-12-04 |
Family
ID=30620946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7767085U Pending JPS61195053U (enExample) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195053U (enExample) |
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1985
- 1985-05-27 JP JP7767085U patent/JPS61195053U/ja active Pending