JPS61168636U - - Google Patents
Info
- Publication number
- JPS61168636U JPS61168636U JP1985052329U JP5232985U JPS61168636U JP S61168636 U JPS61168636 U JP S61168636U JP 1985052329 U JP1985052329 U JP 1985052329U JP 5232985 U JP5232985 U JP 5232985U JP S61168636 U JPS61168636 U JP S61168636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- face
- down mounting
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052329U JPS61168636U (enExample) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052329U JPS61168636U (enExample) | 1985-04-09 | 1985-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168636U true JPS61168636U (enExample) | 1986-10-20 |
Family
ID=30572185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985052329U Pending JPS61168636U (enExample) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168636U (enExample) |
-
1985
- 1985-04-09 JP JP1985052329U patent/JPS61168636U/ja active Pending