JPS62160557U - - Google Patents
Info
- Publication number
- JPS62160557U JPS62160557U JP1986048042U JP4804286U JPS62160557U JP S62160557 U JPS62160557 U JP S62160557U JP 1986048042 U JP1986048042 U JP 1986048042U JP 4804286 U JP4804286 U JP 4804286U JP S62160557 U JPS62160557 U JP S62160557U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor element
- chip carrier
- thickness
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986048042U JPS62160557U (enExample) | 1986-04-02 | 1986-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986048042U JPS62160557U (enExample) | 1986-04-02 | 1986-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160557U true JPS62160557U (enExample) | 1987-10-13 |
Family
ID=30869207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986048042U Pending JPS62160557U (enExample) | 1986-04-02 | 1986-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160557U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213543A (ja) * | 1994-10-20 | 1996-08-20 | Hughes Aircraft Co | マルチダイパッケージ装置 |
| KR101175227B1 (ko) | 2011-06-27 | 2012-08-21 | 매그나칩 반도체 유한회사 | 패키지 |
-
1986
- 1986-04-02 JP JP1986048042U patent/JPS62160557U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213543A (ja) * | 1994-10-20 | 1996-08-20 | Hughes Aircraft Co | マルチダイパッケージ装置 |
| KR101175227B1 (ko) | 2011-06-27 | 2012-08-21 | 매그나칩 반도체 유한회사 | 패키지 |