JPS63131137U - - Google Patents
Info
- Publication number
- JPS63131137U JPS63131137U JP1987023884U JP2388487U JPS63131137U JP S63131137 U JPS63131137 U JP S63131137U JP 1987023884 U JP1987023884 U JP 1987023884U JP 2388487 U JP2388487 U JP 2388487U JP S63131137 U JPS63131137 U JP S63131137U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- groove
- hole
- electrode pads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987023884U JPS63131137U (enExample) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987023884U JPS63131137U (enExample) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131137U true JPS63131137U (enExample) | 1988-08-26 |
Family
ID=30822601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987023884U Pending JPS63131137U (enExample) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131137U (enExample) |
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1987
- 1987-02-19 JP JP1987023884U patent/JPS63131137U/ja active Pending