JPH02137044U - - Google Patents
Info
- Publication number
- JPH02137044U JPH02137044U JP1989043726U JP4372689U JPH02137044U JP H02137044 U JPH02137044 U JP H02137044U JP 1989043726 U JP1989043726 U JP 1989043726U JP 4372689 U JP4372689 U JP 4372689U JP H02137044 U JPH02137044 U JP H02137044U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- divided
- electrode pads
- electrode pad
- columns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W70/682—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/547—
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- H10W72/5473—
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- H10W72/59—
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- H10W72/932—
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- H10W72/9445—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989043726U JPH02137044U (enExample) | 1989-04-14 | 1989-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989043726U JPH02137044U (enExample) | 1989-04-14 | 1989-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137044U true JPH02137044U (enExample) | 1990-11-15 |
Family
ID=31556382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989043726U Pending JPH02137044U (enExample) | 1989-04-14 | 1989-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137044U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007501537A (ja) * | 2003-06-09 | 2007-01-25 | フリースケール セミコンダクター インコーポレイテッド | ワイヤ・ボンドの位置付けを最適化した半導体パッケージ |
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1989
- 1989-04-14 JP JP1989043726U patent/JPH02137044U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007501537A (ja) * | 2003-06-09 | 2007-01-25 | フリースケール セミコンダクター インコーポレイテッド | ワイヤ・ボンドの位置付けを最適化した半導体パッケージ |