JPS62177038U - - Google Patents
Info
- Publication number
- JPS62177038U JPS62177038U JP1986065991U JP6599186U JPS62177038U JP S62177038 U JPS62177038 U JP S62177038U JP 1986065991 U JP1986065991 U JP 1986065991U JP 6599186 U JP6599186 U JP 6599186U JP S62177038 U JPS62177038 U JP S62177038U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pads
- bonding
- chip
- square
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/932—
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986065991U JPS62177038U (enExample) | 1986-04-28 | 1986-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986065991U JPS62177038U (enExample) | 1986-04-28 | 1986-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177038U true JPS62177038U (enExample) | 1987-11-10 |
Family
ID=30903576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986065991U Pending JPS62177038U (enExample) | 1986-04-28 | 1986-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177038U (enExample) |
-
1986
- 1986-04-28 JP JP1986065991U patent/JPS62177038U/ja active Pending