JPS63128729U - - Google Patents
Info
- Publication number
- JPS63128729U JPS63128729U JP1987020434U JP2043487U JPS63128729U JP S63128729 U JPS63128729 U JP S63128729U JP 1987020434 U JP1987020434 U JP 1987020434U JP 2043487 U JP2043487 U JP 2043487U JP S63128729 U JPS63128729 U JP S63128729U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- basic
- bonding pads
- basic bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W70/60—
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- H10W72/932—
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- H10W72/983—
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020434U JPS63128729U (enExample) | 1987-02-14 | 1987-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020434U JPS63128729U (enExample) | 1987-02-14 | 1987-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128729U true JPS63128729U (enExample) | 1988-08-23 |
Family
ID=30815942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987020434U Pending JPS63128729U (enExample) | 1987-02-14 | 1987-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128729U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047853A (ja) * | 1990-04-25 | 1992-01-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2014523601A (ja) * | 2011-07-05 | 2014-09-11 | インテル・コーポレーション | セルフディセーブルチップイネーブル入力 |
-
1987
- 1987-02-14 JP JP1987020434U patent/JPS63128729U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047853A (ja) * | 1990-04-25 | 1992-01-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2014523601A (ja) * | 2011-07-05 | 2014-09-11 | インテル・コーポレーション | セルフディセーブルチップイネーブル入力 |