JPS63124744U - - Google Patents

Info

Publication number
JPS63124744U
JPS63124744U JP1987016862U JP1686287U JPS63124744U JP S63124744 U JPS63124744 U JP S63124744U JP 1987016862 U JP1987016862 U JP 1987016862U JP 1686287 U JP1686287 U JP 1686287U JP S63124744 U JPS63124744 U JP S63124744U
Authority
JP
Japan
Prior art keywords
interlayer insulating
insulating film
bonding pad
wiring
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987016862U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987016862U priority Critical patent/JPS63124744U/ja
Publication of JPS63124744U publication Critical patent/JPS63124744U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/90
    • H10W70/60
    • H10W72/932
    • H10W72/983

Landscapes

  • Wire Bonding (AREA)
JP1987016862U 1987-02-06 1987-02-06 Pending JPS63124744U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987016862U JPS63124744U (enExample) 1987-02-06 1987-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987016862U JPS63124744U (enExample) 1987-02-06 1987-02-06

Publications (1)

Publication Number Publication Date
JPS63124744U true JPS63124744U (enExample) 1988-08-15

Family

ID=30809101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987016862U Pending JPS63124744U (enExample) 1987-02-06 1987-02-06

Country Status (1)

Country Link
JP (1) JPS63124744U (enExample)

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