JPS63191637U - - Google Patents
Info
- Publication number
- JPS63191637U JPS63191637U JP1987082751U JP8275187U JPS63191637U JP S63191637 U JPS63191637 U JP S63191637U JP 1987082751 U JP1987082751 U JP 1987082751U JP 8275187 U JP8275187 U JP 8275187U JP S63191637 U JPS63191637 U JP S63191637U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- layer
- semiconductor substrate
- pad layer
- internal circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/536—
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- H10W72/59—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082751U JPS63191637U (enExample) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082751U JPS63191637U (enExample) | 1987-05-28 | 1987-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191637U true JPS63191637U (enExample) | 1988-12-09 |
Family
ID=30935689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987082751U Pending JPS63191637U (enExample) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191637U (enExample) |
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1987
- 1987-05-28 JP JP1987082751U patent/JPS63191637U/ja active Pending